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| Model | EXCEED8008H | EXCEED8016H | EXCEED8008HW | EXCEED8016HW | EXCEED8001HA-R |
| Test Layout | 1/2/4/8 site | 1/2/4/8/16 site | 1/2/4/8 site | 1/2/4/8/16 site | Single site |
| Temperature type | Dual temp | Dual temp | Dual temp | ||
| Pick-up head | 2x4 module | 2x4 module | 1x2 module | ||
| Contact Force | 240kgf (Option: 480kgf) | 240kgf (Option: 480kgf) | 240kgf (Option: 480kgf) | ||
| Test Opening | 300 mm x 140 mm | 344 mm x 142 mm | 300 mm x 140 mm | ||
| Package Type | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc. | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc. | QFN,QFP,BGA,LGA,PLCC,PGA, CSP,TSOP etc. | ||
| Tray Type | JEDEC | JEDEC | JEDEC | ||
| Temperature Range | +50℃ to +100℃ ±2℃; +100℃ to +130℃ ±3℃ |
+50℃ to +100℃ ±2℃; +100℃ to +130℃ ±3℃ |
+50℃ to +100℃ ±2℃; +100℃ to +130℃ ±3℃ |
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| Heat Dissipation | - | - | 300W@25℃，800W@70℃，1200W@125℃ (50 mm x 50 mm) |
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| Tester Interface | GPIB ,TTL, RS232 ,Network | GPIB ,TTL, RS232 ,Network | GPIB ,TTL, RS232 ,Network | ||
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